Title:
MULTILAYER FILM, PACKAGING MATERIAL, AND REACTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/085228
Kind Code:
A1
Abstract:
Provided are: a multilayer film having good gas-barrier properties and flex resistance and having appropriate flexibility; a packaging material using such a multilayer film; and a reaction apparatus. The present invention comprises at least one layer (A) that contains EVOH as the main component and at least one layer (B) that contains a thermoplastic resin other than the EVOH as the main component. The percentage of the total thickness of the at least one layer (A) and the at least one layer (B) with respect to the total thickness of all of the layers is 90% or more, and satisfies formula (1) and the like. In formula (1), LA is the total thickness of the at least one layer (A). LB is the total thickness of the at least one layer (B). Et is the ethylene unit content (mol%) in the EVOH.
Inventors:
MURAMOTO TAKUYA (JP)
NONAKA YASUHIRO (JP)
SAKANO TAKESHI (JP)
NAKAYA MASAKAZU (JP)
NONAKA YASUHIRO (JP)
SAKANO TAKESHI (JP)
NAKAYA MASAKAZU (JP)
Application Number:
PCT/JP2023/037870
Publication Date:
April 25, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B32B27/28; B65D65/40
Domestic Patent References:
| WO2022080458A1 | 2022-04-21 | |||
| WO2007129371A1 | 2007-11-15 |
Foreign References:
| JP2006272569A | 2006-10-12 |
Attorney, Agent or Firm:
IKEDA Yoshinori (JP)
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