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Title:
MOLDING DEVICE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/176850
Kind Code:
A1
Abstract:
This molding device molds a heated metal material with a molding die, wherein: the molding die has a corner section formed by a first molding surface and a second molding surface which intersect each other in a cross-sectional view; the second molding surface is movable relative to the first molding surface; and during molding, the second molding surface moves the metal material in a pressing direction in a step before the corner section and the metal material make contact with each other.

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Inventors:
ISHIZUKA MASAYUKI (JP)
UENO NORIEDA (JP)
Application Number:
PCT/JP2021/000861
Publication Date:
September 10, 2021
Filing Date:
January 13, 2021
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/047; B21D37/02; B21D37/16
Domestic Patent References:
WO2017155056A12017-09-14
Foreign References:
JP2017177188A2017-10-05
JP3972006B22007-09-05
JP6233987B22017-11-22
JP2009220141A2009-10-01
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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