Title:
MOLD TEMPERATURE CONTROL DEVICE USING THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/244907
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a technique for increasing the manufacturing efficiency of a forming film by reducing the heating and cooling cycle time for the forming film. A mold temperature control device using a thermoelectric element according to an embodiment of the present invention comprises: a mold used for molding a forming film; a heating housing that has a bottom wall body coupled to the bottom surface of the mold to support the mold, and a side wall body formed along the peripheral direction of the bottom wall body and spaced apart from the mold to surround the side surface of the mold; a heating part that is formed between the side wall body and the mold and transfers heat to the mold; a side heat exchange part that is formed between the heating part and the side wall body and dissipates heat toward the side wall body while cooling the heating part using the Peltier effect; and a heat transfer flow path that provides a flow path to heated air so that the heated air, which is the air heated in a space between the side heat exchange part and the side wall body, flows into the upper space of the bottom wall body.
Inventors:
LIM NAM IL (KR)
Application Number:
PCT/KR2021/006559
Publication Date:
November 24, 2022
Filing Date:
May 26, 2021
Export Citation:
Assignee:
REALOOK & COMPANY CO LTD (KR)
International Classes:
B29C51/42; B29C33/04; B29C51/46; H01L35/28
Foreign References:
| KR100666334B1 | 2007-01-11 | |||
| KR20140016692A | 2014-02-10 | |||
| KR20130092900A | 2013-08-21 | |||
| KR20200120238A | 2020-10-21 | |||
| JP2002210762A | 2002-07-30 |
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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