Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2024/084825
Kind Code:
A1
Abstract:
This mold release film comprises: a laminated film in which at least a first coating layer B1 including a polyester resin containing an inorganic pigment, a void-containing layer A containing voids therein, and a second coating layer B2 including a polyester resin containing an inorganic pigment are laminated in this order; and a release layer C on at least one side of the laminated film. The void-containing layer A includes a first composition containing a polyester resin and a polyolefin resin. The release layer C is made of a second composition containing a silicone resin. The apparent density is 0.80 g/cm3 or more and 1.20 g/cm3 or less.
Inventors:
YOSHINO KENJI (JP)
NISHIO SHOTARO (JP)
SHIMIZU AKIRA (JP)
NISHIO SHOTARO (JP)
SHIMIZU AKIRA (JP)
Application Number:
PCT/JP2023/031269
Publication Date:
April 25, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B5/18; B32B7/06; B32B27/00; B32B27/20; B32B27/36
Domestic Patent References:
| WO2019059329A1 | 2019-03-28 | |||
| WO2017170002A1 | 2017-10-05 |
Foreign References:
| JP2001347609A | 2001-12-18 | |||
| JP6619200B2 | 2019-12-11 | |||
| JPH06238786A | 1994-08-30 | |||
| JP2017177563A | 2017-10-05 | |||
| JP2018109092A | 2018-07-12 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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