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Patent Searching and Data


Title:
MOISTURE-CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/048455
Kind Code:
A1
Abstract:
[Problem] The present invention relates to a moisture-curable resin composition which yields a cured product that exhibits excellent displacement-following properties and resin strength while having excellent flame retardancy corresponding to UL94V-0. [Solution] Provided is a moisture-curable resin composition containing components (A) to (D). Component (A): an oxyalkylene polymer having a hydrolyzable silyl group. Component (B): a flame retardant that is liquid at 25°C. Component (C): a flame retardant that is solid at 25°C. Component (D): a curing catalyst.

Inventors:
INOUE KOSHIRO (JP)
NISHIZAWA TAKUTO (JP)
Application Number:
PCT/JP2023/030731
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08L71/02; C08K3/016; C08K3/22; C08L49/00
Foreign References:
JP2019527750A2019-10-03
JP2012188507A2012-10-04
Attorney, Agent or Firm:
IBC (JP)
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