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Title:
MOISTURE-CURABLE POLYURETHANE HOT MELT RESIN COMPOSITION, ADHESIVE, AND SYNTHETIC LEATHER
Document Type and Number:
WIPO Patent Application WO/2024/095530
Kind Code:
A1
Abstract:
The present invention provides a moisture-curable polyurethane hot melt resin composition which contains an isocyanate group-containing hot melt urethane prepolymer (A) and a sulfonic acid group-containing compound (B), and which is characterized in that the hot melt prepolymer (A) contains, as a raw material, a polyol (a) containing 50 mass% or more of a polyether polyol (a1), and that the content of the compound (B) is 0.01-1 parts by mass relative to 100 parts by mass of the hot melt urethane prepolymer (A). The present invention also provides an adhesive characterized by containing the moisture-curable polyurethane hot melt resin composition. The present invention also provides a synthetic leather characterized by having at least a thermoplastic resin layer and a layer of the adhesive.

Inventors:
CHIJIWA HIROYUKI (JP)
KANAGAWA YOSHINORI (JP)
TAKENAKA MASAMI (JP)
Application Number:
PCT/JP2023/024119
Publication Date:
May 10, 2024
Filing Date:
June 29, 2023
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G18/30; C08G18/08; C08G18/10; C08G18/48; C09J7/30; C09J11/06; C09J175/08; D06N3/00; D06N3/14
Domestic Patent References:
WO2019123968A12019-06-27
WO2018173768A12018-09-27
WO2017038195A12017-03-09
Foreign References:
JP2020002262A2020-01-09
JP2003049147A2003-02-21
CN113683951A2021-11-23
JPS5624425A1981-03-09
Attorney, Agent or Firm:
ONO Takayuki (JP)
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