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Patent Searching and Data


Title:
MODULAR BUILD PLATFORMS FOR ADDITIVE MANUFACTURING
Document Type and Number:
WIPO Patent Application WO/2024/064832
Kind Code:
A3
Abstract:
Systems, methods, and devices for additive manufacturing are provided. In some embodiments, a method includes: coupling a plurality of build platforms to a carrier; forming a plurality of 3D objects on the plurality of build platforms using an additive manufacturing process, where each build platform receives at least one 3D object thereon; removing the plurality of build platforms from the carrier; performing post-processing of the plurality of 3D objects while the 3D objects remain on the respective build platforms; and separating the plurality of 3D objects from the respective build platforms.

Inventors:
FÖRSTER-ROMSWINCKEL THOMAS (AT)
GMEINER ROBERT (AT)
MARTL OTMAR (AT)
KESEL OLIVER (AT)
BUSETTI BERNHARD (AT)
KURY MARKUS (AT)
COLE MICHAEL CHRISTOPHER (US)
DORFINGER PETER (US)
STROMENGER SHAWN (US)
MEENAKSHISUNDARAM VISWANATH (US)
PICKENS LANCE ROBERT (US)
Application Number:
PCT/US2023/074797
Publication Date:
May 02, 2024
Filing Date:
September 21, 2023
Export Citation:
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Assignee:
CUBICURE GMBH (AT)
ALIGN TECHNOLOGY INC (US)
International Classes:
B29C64/106; A61C13/00; B29C64/124; B29C64/245; B29C64/35; B33Y10/00; B33Y30/00; B33Y40/20
Domestic Patent References:
WO2018226164A22018-12-13
WO2018170422A12018-09-20
WO2017051029A12017-03-30
Foreign References:
US20220258420A12022-08-18
US20180141268A12018-05-24
US10806546B22020-10-20
EP2956823B12016-06-29
US20180134029A12018-05-17
US20180000570A12018-01-04
US20190090995A12019-03-28
US11440263B22022-09-13
DE29907262U11999-07-15
CN109795113A2019-05-24
US11390027B22022-07-19
Attorney, Agent or Firm:
CHENG, Connie (US)
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