Title:
MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME
Document Type and Number:
WIPO Patent Application WO/2024/080839
Kind Code:
A1
Abstract:
The disclosure relates to radio engineering, for example to a termination load embedded in a printed circuit board substrate and an antenna array including the termination load. The disclosure reduces the complexity and size and increases the reliability of the termination load, as well as in increasing the reliability and speed of wireless data transmission in antenna arrays that use the termination loads. The termination load embedded in the printed circuit board substrate comprises: a fragment of at least one feeding line, a transitional patch, a top resonator patch, a top metal ground layer coplanar with the top patch, wherein a resistive material is disposed in a gap between the top resonator patch and the top metal layer, said fragment of the at least one feeding line terminates in the termination load in the form of an excitation probe, said at least one feeding line is located in the printed circuit board between the bottom ground layer of the printed circuit board and the top layer of the printed circuit board, in which the top resonator patch, the resistive material and the top metal layer are located, the transitional patch is located in the printed circuit board between the layer in which at least one feeding line is located and said top layer, the excitation probe, the transitional patch and the top resonator patch are coupled to each other by electromagnetic coupling.
More Like This:
| JPS5376728 | MICROWAVE CIRCUIT |
| JPH09139608 | TERMINATOR FOR LARGE MICROWAVE/MILLIMETER WAVE POWER |
| JP5241599 | Harmonic termination circuit |
Inventors:
EVTYUSHKIN GENNADIY ALEXANDROVICH (RU)
SHEPELEVA ELENA ALEKSANDROVNA (RU)
LUKYANOV ANTON SERGEEVICH (RU)
SHEPELEVA ELENA ALEKSANDROVNA (RU)
LUKYANOV ANTON SERGEEVICH (RU)
Application Number:
PCT/KR2023/015869
Publication Date:
April 18, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01P1/26; H01P11/00; H01Q1/38; H01Q1/52; H03H7/24
Foreign References:
| US20210367344A1 | 2021-11-25 | |||
| US20190207305A1 | 2019-07-04 | |||
| JPH11330847A | 1999-11-30 | |||
| US4926189A | 1990-05-15 | |||
| KR20100119528A | 2010-11-09 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: