Title:
MINIATURE MAGNETIC SHIELDS WITH MAGNETIC THROUGH SUBSTRATE VIAS
Document Type and Number:
WIPO Patent Application WO/2024/064465
Kind Code:
A3
Abstract:
One or more embodiments relate to custom microfabricated magnetic shields that are configured to provide isolation of superconducting electronics (SCE) circuits/chips from each other and an external environment. Whereas most superconducting circuits require magnetic shielding and most shields work by fully encapsulating the circuits, leaving little access for quite rigid and fragile fibers, one or more embodiments allow custom magnetic shield shapes to be fabricated. In embodiments, to improve the shielding, magnetic vias composed of permalloy can be introduced into the shield design. The vias can connect the magnetic shield to a permalloy layer beneath the silicon substrate.
Inventors:
CANDLER ROBERT N (US)
HAMILTON MICHAEL (US)
ADAMS MARK (US)
HAMILTON MICHAEL (US)
ADAMS MARK (US)
Application Number:
PCT/US2023/071879
Publication Date:
May 02, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
UNIV CALIFORNIA (US)
UNIV AUBURN (US)
UNIV AUBURN (US)
International Classes:
H05K9/00; H01L21/00; H01L23/552; H02K11/01
Foreign References:
| US20100133514A1 | 2010-06-03 | |||
| US20160181227A1 | 2016-06-23 | |||
| US20140145804A1 | 2014-05-29 | |||
| US20050275497A1 | 2005-12-15 | |||
| US20210068320A1 | 2021-03-04 | |||
| US20190182995A1 | 2019-06-13 | |||
| US20160381843A1 | 2016-12-29 | |||
| US20190244831A1 | 2019-08-08 |
Attorney, Agent or Firm:
DANIELSON, Mark J. et al. (US)
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