Title:
MICROPHONE ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/202418
Kind Code:
A1
Abstract:
Disclosed are a microphone assembly and an electronic device. The microphone assembly comprises a substrate, a diaphragm and a back plate. The diaphragm is located between the substrate and the back plate in the direction perpendicular to the plane where the substrate is located. At least one sound hole running through the diaphragm in the thickness direction is provided in a sound wave conduction region of the diaphragm, a partial region of the substrate forms a first electrode, a partial region of the back plate forms a second electrode, and the sound wave conduction region of the diaphragm forms a third electrode. In the direction perpendicular to the plane where the substrate is located, projections of the first electrode, the third electrode and the second electrode overlap each other. According to the microphone assembly provided by the present invention, a differential capacitance solution of a single diaphragm is realized, and the performance of the microphone assembly is improved.
Inventors:
RONG GENLAN (CN)
LIU QING (CN)
LIU QING (CN)
Application Number:
PCT/CN2023/087481
Publication Date:
October 26, 2023
Filing Date:
April 11, 2023
Export Citation:
Assignee:
MEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD (CN)
International Classes:
H04R7/18; H04R19/04; H04R19/00
Foreign References:
| CN114520947A | 2022-05-20 | |||
| CN107360526A | 2017-11-17 | |||
| CN215935098U | 2022-03-01 | |||
| US20070286438A1 | 2007-12-13 | |||
| US20150146906A1 | 2015-05-28 | |||
| CN107244646A | 2017-10-13 | |||
| CN104902415A | 2015-09-09 | |||
| CN105721997A | 2016-06-29 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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