Title:
MICROELECTROMECHANICAL SYSTEM SWITCH AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/201488
Kind Code:
A1
Abstract:
Provided are a microelectromechanical system switch and a communication device, comprising a substrate (101); a direct-current bias line (102) located on one side of the substrate (101); a first signal transmission line (103) and a second signal transmission line (104) located on the same side of the substrate (101) as the direct-current bias line (102), wherein the first signal transmission line (103), the second signal transmission line (104) and the direct-current bias line (102) are provided side by side at intervals, and the first signal transmission line (103) and the second signal transmission line (104) are separately located on two sides of the direct-current bias line (102); a cantilever beam (105) located on the side of the layer, where the first signal transmission line (103) is located, away from the substrate, wherein the cantilever beam (105) spans the direct-current bias line (102) and a gap is provided between the cantilever beam (105) and the direct-current bias line (102) in a direction perpendicular to the substrate (101), the cantilever beam (105) comprises a fixed end (51) and a free end (52), the fixed end (51) is connected to the second signal transmission line (104), the orthographic projection of the free end on the substrate (101) is located within the orthographic projection of the first signal transmission line (103) on the substrate, and a gap is provided between the free end (52) and the first signal transmission line (103) in the direction perpendicular to the substrate (101); and a fixing structure (106) which is located on the side of the layer, where the first signal transmission line (103) is located, away from the substrate (101) and is not in contact with the first signal transmission line (103), the fixing structure (106) being connected to the free end (52) and the substrate (101).
Inventors:
SHI YINGLI (CN)
LI YANZHAO (CN)
LI YANZHAO (CN)
Application Number:
PCT/CN2022/087492
Publication Date:
October 26, 2023
Filing Date:
April 18, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
International Classes:
H01P1/10; H01H59/00
Foreign References:
| CN201518299U | 2010-06-30 | |||
| US6373007B1 | 2002-04-16 | |||
| US6307169B1 | 2001-10-23 | |||
| US20080062013A1 | 2008-03-13 | |||
| US6570750B1 | 2003-05-27 | |||
| CN110137634A | 2019-08-16 | |||
| CN101763986A | 2010-06-30 | |||
| CN101276708A | 2008-10-01 | |||
| US20050244099A1 | 2005-11-03 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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