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Patent Searching and Data


Title:
METHOD FOR REPAIRING SOLID PLATE EXTRUSION DIE
Document Type and Number:
WIPO Patent Application WO/2023/103920
Kind Code:
A1
Abstract:
Disclosed in the present invention is a method for repairing a solid plate extrusion die. The method comprises: (1) carrying out extrusion by using an original extrusion die to obtain a sample plate; (2) measuring the distribution condition of coarse grain rings of the sample plate; and (3) repairing the extrusion die according to the distribution condition of coarse grain rings; when the coarse grain rings are annularly distributed and the maximum thickness of the coarse grain rings tmax is greater than or equal to 0.25 T, adjusting the components and the heat treatment process of the aluminum alloy; when the coarse grain rings are annularly distributed and the maximum thickness of the coarse grain rings tmax is less than 0.25 T, forming a welding block on a face mold of the extrusion die; and when the coarse grain rings are locally distributed, shortening the length of the working belt of the extrusion die. By implementing the present invention, the uniformity of the internal structure of the product can be effectively improved, and the distribution of coarse grain rings is reduced.

Inventors:
ZOU SHANGFENG (CN)
YAN LANFANG (CN)
LI YONGCHAO (CN)
CHEN JIAN (CN)
CHEN LI (CN)
Application Number:
PCT/CN2022/136409
Publication Date:
June 15, 2023
Filing Date:
December 03, 2022
Export Citation:
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Assignee:
GUANGDONG JMA ALUMINUM PROFILE FACTORY GROUP CO LTD (CN)
FOSHAN JMA ALUMINIUM IND CO LTD (CN)
International Classes:
B23P6/00
Foreign References:
CN114310142A2022-04-12
CN112792149A2021-05-14
CN106111717A2016-11-16
CN205096264U2016-03-23
CN106925940A2017-07-07
CN103538180A2014-01-29
CN109161828A2019-01-08
US20090205752A12009-08-20
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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