Title:
METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, METHOD FOR DETERMINING MOLDABILITY OF THERMOPLASTIC RESIN COMPOSITION, AND THERMOPLASTIC RESIN COMPOSITION FOR MOLDING AT TEMPERATURE THAT IS NOT LESS THAN DECOMPOSITION TEMPERATURE OF ELASTOMER
Document Type and Number:
WIPO Patent Application WO/2023/223738
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide: a thermoplastic resin composition to which an elastomer is added, and which is capable of remarkably reducing the formation of mold adhering matters during molding especially in gas vents and clogging of the gas vents during injection molding of the thermoplastic resin composition at a temperature that is not less than the decomposition temperature of the elastomer, thereby being capable of suppressing the occurrence of gas scorching of an injection molded body; and a method for producing a thermoplastic resin composition. Another purpose of the present invention is to provide a method for determining whether or not operations of injection molding can be stably performed when a thermoplastic resin composition is injection molded at a temperature that is not less than the decomposition temperature of an elastomer. The present invention provides a method for producing a thermoplastic resin composition which contains at least one thermoplastic resin that is selected from the group consisting of polyarylene sulfide resins, aromatic polyamide resins and syndiotactic polystyrene resins, an elastomer and an antioxidant, the method comprising a step in which the thermoplastic resin, the elastomer and the antioxidant are mixed with each other such that the formulae (mathematical formulae 1) are satisfied if a0 is the amount of gases having a boiling point of less than (T0 + 20)°C among the gases having a boiling point of 0°C to 400°C, the gases being generated during injection molding of the thermoplastic resin composition at a mold temperature T0°C that is not less than 40°C at the injection rate of 10 cm3/second, b0 is the amount of gases having a boiling point of not less than (T0 - 20)°C among the gases having a boiling point of 0°C to 400°C, the gases being generated during the injection molding, and b10 is the amount of gases having a boiling point of not less than (T10 - 20)°C among the gases having a boiling point of 0°C to 400°C, the gases being generated during injection molding of the thermoplastic resin composition wherein the thermoplastic resin composition is injected into a mold at a mold temperature T10°C that is not less than 40°C at the injection rate of 10 cm3/second, retained therein for 10 minutes, and subsequently molded (meanwhile, the unit of a0, b0 and b10 is µg per 1 g of the thermoplastic resin composition, and T0 = T10).
Inventors:
JUNG SUNGYI (JP)
Application Number:
PCT/JP2023/015364
Publication Date:
November 23, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L101/00; C08K3/014; C08K5/00; C08L21/00; C08L81/02
Domestic Patent References:
| WO2017010364A1 | 2017-01-19 |
Foreign References:
| JPH10279802A | 1998-10-20 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
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