Title:
METHOD FOR PRODUCING PARTICLE BOARD, AND COMPRESSED MATERIAL FOR PRODUCING PARTICLE BOARD
Document Type and Number:
WIPO Patent Application WO/2023/188911
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing a method for producing a particle board, the method being capable of producing a high-strength particle board. The method for producing a particle board according to the present disclosure includes a compression step, a fragmentation step, a forming step, and a thermal compression step. In the compression step, a pulverized product of Palmae plant is compressed to obtain a compressed material. In the fragmentation step, the compressed material is cut to obtain small pieces. In the forming step, a mat is obtained by adding an adhesive to the small pieces and forming. In the thermal compression step, the mat is compressed while being heated. The pulverized product contains chips having a length of 5.0 mm to 100.0 mm and an outer diameter of 1.0 mm to 10.0 mm. The content of the chips is at least 70 mass% with respect to the total mass of the pulverized product.
Inventors:
MAEDA NAOHIKO
ASADA TEPPEI
INOUE TAKAFUMI
ASADA TEPPEI
INOUE TAKAFUMI
Application Number:
PCT/JP2023/005043
Publication Date:
October 05, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B27N3/06
Domestic Patent References:
| WO2021112749A1 | 2021-06-10 |
Foreign References:
| JP2003260705A | 2003-09-16 | |||
| JP2012214013A | 2012-11-08 | |||
| JP2007331286A | 2007-12-27 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF:
Previous Patent: LAMINATE FORMING DEVICE AND LAMINATE FORMING SYSTEM
Next Patent: BASE STATION, TERMINAL AND COMMUNICATION METHOD
Next Patent: BASE STATION, TERMINAL AND COMMUNICATION METHOD