Title:
METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM, AND METHOD FOR PRODUCING ELECTROMAGNETIC WAVE SHIELDING BODY
Document Type and Number:
WIPO Patent Application WO/2024/070844
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for producing an electroconductive film having excellent adherence. The present invention also addresses the problem of providing a method for producing an electromagnetic wave shielding body. A method for producing an electroconductive film according to the present invention comprises: a step 1 for applying ink that includes at least one of a metallic salt and a complex, to form a coating film; a step 2 for subjecting the coating film to a light irradiation treatment; step 3 for subjecting the coating film obtained in step 2 to a light irradiation treatment, to obtain an electroconductive film. The wavelength WL2, which is the most intense wavelength of the irradiation light of the light irradiation treatment in step 2, and the wavelength WL3, which is the most intense wavelength of the irradiation light of the light irradiation treatment in step 3, satisfy WL2 < WL3, and the exposure amount EA2 of the light irradiation treatment in step 2 and the exposure amount EA3 of the light irradiation treatment in step 3 satisfy EA2 < EA3.
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Inventors:
FUJII YUSUKE (JP)
SAWANO MITSURU (JP)
SAWANO MITSURU (JP)
Application Number:
PCT/JP2023/034067
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C18/14; C09D11/02; C09D11/30; H05K9/00
Domestic Patent References:
| WO2008041551A1 | 2008-04-10 |
Foreign References:
| JP2010530441A | 2010-09-09 | |||
| JP2009277640A | 2009-11-26 | |||
| JP2014038749A | 2014-02-27 | |||
| JP2017532749A | 2017-11-02 | |||
| KR20080014707A | 2008-02-14 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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