Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR PLATING EDGE CONNECTORS ON CIRCUIT BOARD WITH GOLD, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/040888
Kind Code:
A1
Abstract:
The present application relates to the processing field of circuit boards. Disclosed are a method for plating edge connectors on a circuit board with gold, and a circuit board. The method comprises the following steps: filling gaps between edge connectors on a circuit board with a conductive medium, wherein the height of the conductive medium is greater than the height of each edge connector; enabling a tip of a first probe to be tangent to an upper surface of the conductive medium, and placing a tip of a second probe above the edge connector, wherein the tip of the second probe and the tip of the first probe are located in the same horizontal plane; connecting the first probe and the second probe to a loop on/off detection device; plating an upper surface of the edge connector with gold, and stopping gold plating when the loop on/off detection device detects the connection of a loop; and removing the conductive medium. In the present application, the gaps between the edge connectors are filled with the conductive medium, the height of which is greater than that of the edge connector, the tip of the first probe is tangent to the upper surface of the conductive medium, the tip of the second probe is flush with the tip of the first probe, and gold plating is stopped when each gold-plated layer comes into contact with the tip of the second probe, such that the gold-plated layers on all the edge connectors are equal in thickness; and there is no need to manufacture a lead wire.

Inventors:
CHEN FENGYUE (CN)
MAO XIAOTONG (CN)
Application Number:
PCT/CN2023/077152
Publication Date:
February 29, 2024
Filing Date:
February 20, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUZHOU METABRAIN INTELLIGENT TECH CO LTD (CN)
International Classes:
H05K3/40; C25D5/02; C25D7/00; H05K3/24
Foreign References:
CN115103530A2022-09-23
CN105483805A2016-04-13
CN106231816A2016-12-14
CN110324979A2019-10-11
CN104918421A2015-09-16
CN201601893U2010-10-06
CN103037626A2013-04-10
JPH04110491A1992-04-10
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
Download PDF: