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Title:
METHOD FOR MODELING BY USING SHIP CARRIER FRAME DEVICE AND SHIP CARRIER FRAME DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/100542
Kind Code:
A1
Abstract:
A method for modeling by using a ship carrier frame device, by which a bottom portion of ship may be molded and de-molded, comprising: molding a ship carrier frame and a sundry layer to shape an epoxy resin mixture, compression molding the epoxy resin mixture by means of a ship bottom mold to form a new ship carrier frame, wherein the integrity of a ship body may be observed from the ship carrier frame, having a good inspection effect for ship bottom construction. The method for modeling adjusts modeling for ship bottoms of different shapes, and an air drying device (1) may accelerate the forming time of a mold, while a cleaning device (9) may automatically clean an equipment and may further effectively reduce pungent odors to improve the surrounding environment; the method has the characteristics of the shaping effect being diversified, operation being simple and the method being novel.

Inventors:
LI CHUNHONG (CN)
Application Number:
PCT/CN2018/000048
Publication Date:
May 31, 2019
Filing Date:
January 25, 2018
Export Citation:
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Assignee:
LI CHUNHONG (CN)
International Classes:
B63B9/06; B29C39/02
Foreign References:
CN107901311A2018-04-13
CN107902044A2018-04-13
CN107932806A2018-04-20
CN107932810A2018-04-20
CN101641254A2010-02-03
CN203402376U2014-01-22
CN103879512A2014-06-25
KR20120081695A2012-07-20
Attorney, Agent or Firm:
NANNING SHENZHIYI PATENT AGENCY OFFICE (SPECIALIZED GENERAL PARTNERSHIP) (CN)
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