Title:
METHOD FOR LINEARLY CUTTING OBJECT TO BE CUT BY USING LINE LASER BEAM
Document Type and Number:
WIPO Patent Application WO/2024/019197
Kind Code:
A1
Abstract:
In order to address the above problem, an embodiment of the present invention provides a method for linearly cutting an object to be cut by using a line layer beam, the method including: a first step of loading and disposing an object to be cut, which includes a brittle material, to a lower side of a laser part; a second step of emitting a line laser beam having a major axis/minor axis ratio generated by the layer part to the object to be cut to form cracks; a third step of forming a linear cutting line by connecting the cracks while moving the line laser beam in a straight line along an expected cutting line of the object to be cut; and a fourth step of cutting the object to be cut by the cutting line.
Inventors:
KIM BO GYEOM (KR)
KIM SEON JOO (KR)
PARK JAE WOONG (KR)
KIM SEON JOO (KR)
PARK JAE WOONG (KR)
Application Number:
PCT/KR2022/010848
Publication Date:
January 25, 2024
Filing Date:
July 25, 2022
Export Citation:
Assignee:
COWINDST CO LTD (KR)
International Classes:
B23K26/38; B23K26/04; B23K26/08; B23K26/70; B23K103/00
Foreign References:
| KR20100107252A | 2010-10-05 | |||
| KR20150028914A | 2015-03-17 | |||
| JPH09150286A | 1997-06-10 | |||
| KR20010017690A | 2001-03-05 | |||
| KR20000040562A | 2000-07-05 |
Attorney, Agent or Firm:
SEOHAN INTELLECTUAL PROPERTY LAW FIRM (KR)
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