Title:
METHOD FOR EVALUATING RESIN MATERIAL, RESIN MATERIAL, METHOD FOR PRODUCING RESIN MATERIAL, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/119595
Kind Code:
A1
Abstract:
The present invention provides a method for evaluating a resin material, the method comprising: a step in which a test piece that comprises a resin material and a metal film that is arranged on the surface of the resin material is prepared; a step in which the test piece is subjected to the pretreatments (1) and (2) described below in this order; and a step in which a peel test of the metal film is performed using the test piece after the pretreatments. (1) The test piece is maintained in an environment at a temperature of 60°C to 100°C and a relative humidity of 60% to 100% for 15 hours or more. (2) The test piece is heated under such conditions that the highest temperature reached by the test piece is 200°C or higher.
Inventors:
SAITO TAKESHI (JP)
KAMIMURA KAZUYA (JP)
KAMIMURA KAZUYA (JP)
Application Number:
PCT/JP2021/048025
Publication Date:
June 29, 2023
Filing Date:
December 23, 2021
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
G01N19/00
Domestic Patent References:
| WO2021124113A1 | 2021-06-24 |
Foreign References:
| JP2003301162A | 2003-10-21 | |||
| JP2015187271A | 2015-10-29 | |||
| JP2015054890A | 2015-03-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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