Title:
METHOD FOR DETECTING APPEARANCE OF DIES AFTER WAFER DICING
Document Type and Number:
WIPO Patent Application WO/2024/001595
Kind Code:
A1
Abstract:
The present invention provides a method for detecting the appearance of dies after wafer dicing, comprising: feeding a plurality of dies at a feeding station, and transferring the dies to different stations to sequentially perform the following steps: performing optical detection on the surfaces of the plurality of dies facing upwards; turning the dies over to change the surfaces of the plurality of dies facing upwards and then performing optical detection; and grading unqualified dies according to the detection result and outputting same. A plurality of defect levels are correspondingly defined on the basis of different defect characteristics, and correspondence relationships between the defect levels and discharging ports are defined; and an upper computer controls a sorting station to output a target die from a corresponding discharging port on the basis of the correspondence relationship and the defect level of the target die. The present invention features a reasonable transfer process, a short takt time, and high integration, and graded output is beneficial to subsequent quality evaluation and unqualified die repairing for reutilization, and thus the overall production efficiency is improved.
Inventors:
XIAO ZHIXIANG (CN)
ZHU TAO (CN)
SHANG QIUFENG (CN)
YE KUN (CN)
ZHU TAO (CN)
SHANG QIUFENG (CN)
YE KUN (CN)
Application Number:
PCT/CN2023/094923
Publication Date:
January 04, 2024
Filing Date:
May 18, 2023
Export Citation:
Assignee:
SUZHOU JINGLAI OPTO CO LTD (CN)
WUHAN JINGCE ELECTRONIC GROUP CO LTD (CN)
WUHAN JINGCE ELECTRONIC GROUP CO LTD (CN)
International Classes:
B07C5/36
Foreign References:
| CN115274477A | 2022-11-01 | |||
| CN113740347A | 2021-12-03 | |||
| CN114602818A | 2022-06-10 | |||
| CN113401649A | 2021-09-17 | |||
| JP2011117866A | 2011-06-16 |
Attorney, Agent or Firm:
WUHAN JINGCE ELECTRONIC GROUP CO., LTD (CN)
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