Title:
METHOD FOR CUTTING SHEET MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/112612
Kind Code:
A1
Abstract:
The purpose of the present invention is to prevent the occurrence of cracks in the cut surface of a brittle material layer when cutting a sheet material having the brittle material layer. A method for cutting a sheet material according to the present invention includes: a step for preparing a sheet material 11 having a brittle material layer 2 in which a weak line 4 extending in a first direction is formed; and a step of cutting the sheet material 11 along the weak line 4 by adding a pressing force at the location corresponding to the weak line 4 of the sheet material 11 while applying tension to the sheet material 11 in a second direction, which is a direction orthogonal to the first direction.
Inventors:
SHINOZAKI TAKAHIRO (JP)
KANNO TOSHIHIRO (JP)
HIRATA SATOSHI (JP)
NAKAI KOTA (JP)
KANNO TOSHIHIRO (JP)
HIRATA SATOSHI (JP)
NAKAI KOTA (JP)
Application Number:
PCT/JP2022/043033
Publication Date:
June 22, 2023
Filing Date:
November 21, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B23K26/364; B28D5/00; C03B33/033
Domestic Patent References:
WO2006073098A1 | 2006-07-13 | |||
WO2019138967A1 | 2019-07-18 |
Foreign References:
JP2003277089A | 2003-10-02 | |||
JPH02130103A | 1990-05-18 | |||
JPS57109918A | 1982-07-08 | |||
JP2016043688A | 2016-04-04 | |||
JPH10506087A | 1998-06-16 |
Attorney, Agent or Firm:
MAKOTO INTERNATIONAL PATENT ATTORNEYS OFFICE (JP)
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