Title:
METHOD FOR COARSENING COPPER CRYSTAL GRAINS IN OBJECTS TO BE PLATED AND COPPER-PLATED MEMBRANE HAVING COARSENED COPPER CRYSTAL GRAINS IN COPPER-PLATED MEMBRANE
Document Type and Number:
WIPO Patent Application WO/2023/074223
Kind Code:
A1
Abstract:
A copper-plated membrane having coarsened crystals can be obtained by a simple operation, by using a method for coarsening copper crystal grains in an object to be plated, said method being characterized by including: a step (a) in which the object to be plated is electroplated using an electrolytic copper plating solution that contains sulfuric acid, copper sulfate, chloride ions, a brightener, and a leveler and containing at least 200g/L of sulfuric acid; and a step (b) in which the electroplated object to be plated is heat treated at no more than 400°C.
Inventors:
SAWA MASAHIRO (JP)
SONE ERIKO (JP)
OHNO AKINOBU (JP)
SONE ERIKO (JP)
OHNO AKINOBU (JP)
Application Number:
PCT/JP2022/035799
Publication Date:
May 04, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
JCU CORP (JP)
International Classes:
C25D5/50; C25D1/00; C25D1/04; C25D3/38
Foreign References:
| JP2008088524A | 2008-04-17 | |||
| JPH07102392A | 1995-04-18 | |||
| JP2012127003A | 2012-07-05 | |||
| JP2014222715A | 2014-11-27 | |||
| JP6782477B2 | 2020-11-11 | |||
| JP5724068B2 | 2015-05-27 | |||
| JP4895734B2 | 2012-03-14 |
Other References:
KOICHIRO INOUE ET AL.: "Surface Morphology and Orientation of Electrodeposited Fe Films", JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS, vol. 65, no. 4, 2001, pages 229 - 235
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY OF ONO & CO. (JP)
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