Title:
METHOD AND APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND PRODUCT AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2024/083181
Kind Code:
A1
Abstract:
A method and apparatus for manufacturing a flexible printed circuit board, and a product and a vehicle, which relate to the technical field of communications. The structure of the flexible printed circuit board comprises a first cover layer (101), a first copper-clad layer (102), a substrate layer (103), a second copper-clad layer (104) and a second cover layer (105), which are sequentially stacked from top to bottom, wherein the first copper-clad layer (102) and the second copper-clad layer (104) are symmetrically arranged in a direction parallel to the substrate layer (103); and the first copper-clad layer (102) is used for one end of a differential signal when same is transmitted, and the second copper-clad layer (104) is used for the other end of the differential signal when same is transmitted. The method for manufacturing a flexible printed circuit board comprises: according to a predetermined impedance value, calculating a size parameter of a flexible printed circuit board by using impedance calculation software (201); and according to the size parameter and the structure of the flexible printed circuit board, manufacturing the flexible printed circuit board (202). By using the principle of magnetic-field cancelation, external electromagnetic interference caused by a differential signal due to a sudden change in voltage is reduced, and by using the characteristic of symmetry of the first copper-clad layer (102) and the second copper-clad layer (104), interference voltages generated by the outside on the first copper-clad layer and the second copper-clad layer are the same, such that an interference voltage can finally be canceled by means of subtraction.
Inventors:
WANG CHAO (CN)
Application Number:
PCT/CN2023/125382
Publication Date:
April 25, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
CHANGCHUN JETTY AUTOMOTIVE TECH CO LTD (CN)
International Classes:
H05K3/02; B60R16/023; H05K3/46
Foreign References:
| CN115460787A | 2022-12-09 | |||
| CN218868431U | 2023-04-14 | |||
| CN209420004U | 2019-09-20 | |||
| CN112040637A | 2020-12-04 | |||
| CN207039995U | 2018-02-23 | |||
| CN102291951A | 2011-12-21 | |||
| CN209218451U | 2019-08-06 | |||
| CN209806161U | 2019-12-17 | |||
| CN214101895U | 2021-08-31 | |||
| KR20000075227A | 2000-12-15 |
Attorney, Agent or Firm:
BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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