Title:
METHOD FOR ADJUSTING THERMAL UNIFORMITY IN WAFER MOUNTING BASE AND METHOD FOR PRODUCING WAFER MOUNTING BASE
Document Type and Number:
WIPO Patent Application WO/2024/075208
Kind Code:
A1
Abstract:
The present invention provides a method that makes it possible to adjust thermal uniformity in a placement surface after production of a wafer mounting base. Performed are: a) a step for preparing a wafer mounting base comprising a ceramic substrate that is provided with a placement surface for a wafer and that can be energized and heated and a cooling plate that is joined to the ceramic substrate and that enables cooling via a coolant supplied to a flow path, wherein the cooling plate is constituted by a base part that is provided with a flow path and a cover part that is attachable to and removable from the base part, and that enables opening of the flow path by being removed from the base part; b) a step for attaching the cover part to the base part and measuring a temperature distribution while performing energizing/heating and cooling; c) a step for removing the cover part and locally adjusting flow path shape when the temperature distribution does not satisfy a prescribed criterion; and d) a step for re-measuring the temperature distribution of the wafer mounting base which has an adjusted flow path shape, while performing energization/heating and cooling after attaching the cover part to the base part. Steps c) and d) are repeated until the re-measured temperature distribution satisfies the prescribed criterion.
Inventors:
SUGIMOTO HIROYA (JP)
MORIOKA IKUHISA (JP)
MINE KEITA (JP)
TAMURA RYUJI (JP)
HIRATA NATSUKI (JP)
KAJIURA YOHEI (JP)
MORIOKA IKUHISA (JP)
MINE KEITA (JP)
TAMURA RYUJI (JP)
HIRATA NATSUKI (JP)
KAJIURA YOHEI (JP)
Application Number:
PCT/JP2022/037254
Publication Date:
April 11, 2024
Filing Date:
October 05, 2022
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/683
Foreign References:
| JP2020013931A | 2020-01-23 | |||
| JPH09312281A | 1997-12-02 | |||
| JP2020053576A | 2020-04-02 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF: