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Title:
METAMATERIAL SUBSTRATE, METAMATERIAL, LAMINATE BODY, AND METAMATERIAL PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/162662
Kind Code:
A1
Abstract:
Provided are: a metamaterial substrate having a thermal dimensional change rate, when left to stand for 24 hours in a 90°C environment, of at least 0.01% but less than 10%; a metamaterial and laminate body provided with the metamaterial substrate; and a metamaterial production method.

Inventors:
SASADA YASUYUKI (JP)
Application Number:
PCT/JP2023/003882
Publication Date:
August 31, 2023
Filing Date:
February 06, 2023
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/028; C08J5/18; B32B27/30; B32B27/36; H01P1/00; H01P7/08
Domestic Patent References:
WO2018221500A12018-12-06
Foreign References:
JP2021160148A2021-10-11
JP2002331589A2002-11-19
JP2019100837A2019-06-24
JP2017175201A2017-09-28
JP2006137011A2006-06-01
JP2004281502A2004-10-07
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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