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Patent Searching and Data


Title:
METAL WIRE JOINING METHOD AND METAL WIRE JOINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/162235
Kind Code:
A1
Abstract:
[Problem] To provide a metal wire joining method and a metal wire joining system which are capable of joining metal wires regardless of the types of metal materials. [Solution] This metal wire joining system 1 has: a cavity resonator 3 in which a joining part W1a of a metal wire W1 and a joining part W2a of a metal wire W2 are disposed; a microwave generation/control device 11 and a microwave supplier 5 which supply microwaves to the cavity resonator 3; and a holding mechanism 9 which holds the metal wires W1, W2 so that the position of the center point CP between the joining parts W1a, W2a can move in the supply direction of the microwaves.

Inventors:
HONDA TOMOKAZU (JP)
NISHIOKA MASATERU (JP)
NAKAMURA TAKASHI (JP)
UEMURA SEI (JP)
Application Number:
PCT/JP2022/008324
Publication Date:
August 31, 2023
Filing Date:
February 28, 2022
Export Citation:
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Assignee:
YASKAWA ELECTRIC CORP (JP)
AIST (JP)
International Classes:
B23K10/02
Foreign References:
JP2019136771A2019-08-22
JP2020173958A2020-10-22
JP2020111831A2020-07-27
JP2021060153A2021-04-15
JPH0485836A1992-03-18
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION DAI-ICHI TECHNICAL INTERNATIONAL PATENT FIRM (JP)
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