Title:
METAL MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/014782
Kind Code:
A1
Abstract:
The present invention relates to an electroconductive contact pin, and the objective of the present invention is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.
Inventors:
AHN BUM MO (KR)
PARK SEUNG HO (KR)
HONG CHANG HEE (KR)
PARK SEUNG HO (KR)
HONG CHANG HEE (KR)
Application Number:
PCT/KR2023/009537
Publication Date:
January 18, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
POINT ENGINEERING CO LTD (KR)
International Classes:
G01R1/067; C25D1/00; G01R1/04; G01R3/00; G01R31/28
Foreign References:
| KR20220049203A | 2022-04-21 | |||
| KR20100045899A | 2010-05-04 | |||
| KR20110025007A | 2011-03-09 | |||
| KR101711785B1 | 2017-03-02 | |||
| CN213903610U | 2021-08-06 |
Attorney, Agent or Firm:
CHOI, Kwang Seok (KR)
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