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Title:
METAL-BONDED GRINDING WHEEL
Document Type and Number:
WIPO Patent Application WO/2023/100634
Kind Code:
A1
Abstract:
A metal-bonded grinding wheel comprising an abrasive grain layer in which a plurality of abrasive grains and a plurality of pores are dispersed in a metal bonding material. The porosity of the plurality of pores in the abrasive grain layer is between 40% and 99% inclusive.

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Inventors:
NAKANE YOSHINORI (JP)
SATO MANABU (JP)
NAKA MASANORI (JP)
TAKANABE RYUICHI (JP)
Application Number:
PCT/JP2022/042252
Publication Date:
June 08, 2023
Filing Date:
November 14, 2022
Export Citation:
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Assignee:
ASAHI DIAMOND IND (JP)
International Classes:
B24D3/10; B24D3/02; B24D3/06
Domestic Patent References:
WO2020158631A12020-08-06
Foreign References:
JP2010540261A2010-12-24
JP2000198075A2000-07-18
JPS59182064A1984-10-16
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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