Title:
MEMS SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/176082
Kind Code:
A1
Abstract:
Provided is a MEMS sensor comprising a semiconductor substrate, a sensor portion formed on the semiconductor substrate, a pad portion formed on the semiconductor substrate, and a connection wire which is formed on the semiconductor substrate and connects the sensor portion and the pad portion to each other. The connection wire is a semiconductor wire formed of a semiconductor material.
Inventors:
SAKURAGI MASAHIRO (JP)
Application Number:
PCT/JP2022/046939
Publication Date:
September 21, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
G01L9/00; B81B3/00; H01L29/84
Foreign References:
| JP2010223766A | 2010-10-07 | |||
| JP2011013179A | 2011-01-20 | |||
| CN103335753A | 2013-10-02 | |||
| JPS54103684A | 1979-08-15 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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