Title:
MEMS MICROPHONE CHIP
Document Type and Number:
WIPO Patent Application WO/2023/206644
Kind Code:
A1
Abstract:
Provided is a MEMS microphone chip, comprising a substrate, a first diaphragm fixed to the substrate, a supporting member fixed to the first diaphragm, and a second diaphragm fixed to the supporting member and spaced apart from the first diaphragm; the second diaphragm comprises a supporting portion supported on the supporting member and a free end surrounding the supporting portion; the projection of the free end in a vibration direction falls into a back cavity. The second diaphragm is configured to be a cantilever beam structure having a free end, and the middle part of the first diaphragm having a maximum displacement is used for driving the second diaphragm having the free end in connection with the middle part by means of the supporting member, so that the limitation of stress and thickness on the vibration performance of the second diaphragm is remarkably reduced, and the sensitivity of the second diaphragm is effectively improved, thereby improving the signal-to-noise ratio of the MEMS microphone chip.
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Inventors:
ZHAO ZHUANZHUAN (CN)
ZHANG RUI (CN)
ZHANG RUI (CN)
Application Number:
PCT/CN2022/093426
Publication Date:
November 02, 2023
Filing Date:
May 18, 2022
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/00
Domestic Patent References:
| WO2022000794A1 | 2022-01-06 |
Foreign References:
| US20160112801A1 | 2016-04-21 | |||
| CN103686570A | 2014-03-26 | |||
| CN102264020A | 2011-11-30 |
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