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Patent Searching and Data


Title:
MECHANICAL ARM AND ASSEMBLY THEREOF, TESTING SYSTEM AND METHOD, STORAGE MEDIUM AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/160645
Kind Code:
A1
Abstract:
A mechanical arm for semiconductor structure testing. The mechanical arm comprises a body (10) and an operating arm (20), wherein the operating arm (20) comprises a connector (21), a first transfer portion (22) and a second transfer portion (23), and the connector (21) is connected to the body (10); the first transfer portion (22) is connected to the connector (21), and the first transfer portion (22) is used for mounting a first operating mechanism (2) for opening and closing a base (1); the second transfer portion (23) is connected to the connector (21), and the second transfer portion (23) is used for mounting a second operating mechanism (3) for grabbing and releasing a semiconductor device; and after the first transfer portion (22) drives the first operating mechanism (2) to open the base (1), the second transfer portion (23) can drive the second operating mechanism (3) to put a semiconductor device into the base (1) or take the semiconductor device out from the base (1). The mechanical arm automatically grabs and releases a semiconductor device and automatically opens and closes the base throughout a test process, thus improving the test efficiency. The present application also relates to a mechanical arm assembly, a semiconductor structure testing system and method, a storage medium and an electronic apparatus.

Inventors:
YU YU (CN)
Application Number:
PCT/CN2021/110981
Publication Date:
August 04, 2022
Filing Date:
August 05, 2021
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
B25J11/00; B07C5/02
Foreign References:
CN111830401A2020-10-27
CN112958467A2021-06-15
CN110921317A2020-03-27
CN210704803U2020-06-09
CN209167331U2019-07-26
JP3905659B22007-04-18
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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