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Patent Searching and Data


Title:
MEASURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/192685
Kind Code:
A1
Abstract:
Provided is a measuring device capable of accurately measuring a distortion of a mold while achieving small stiffness change of a facility and achieving easy installation. A measuring device 20 measures a distortion of a lower mold 30. The measuring device 20 comprises: a hollow casing 21 which is inserted in a groove of a T groove 11 constituted of a narrow width portion 11a and a wide width portion 11b provided in a lower bolster 10 which supports the lower mold 30; and a distortion gauge 22 attached to an inner surface of the casing 21. The casing 21 is inserted into the groove with at least a part thereof elastically deformed.

Inventors:
KOBAYASHI TAKUO (JP)
SATO TATSUYA (JP)
OKADA TOMOHIRO (JP)
KOBAYASHI KOTA (JP)
Application Number:
PCT/JP2021/004934
Publication Date:
September 30, 2021
Filing Date:
February 10, 2021
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B30B15/28; G01L5/00
Foreign References:
JP2007326135A2007-12-20
JP2018164939A2018-10-25
JP2009244151A2009-10-22
JPH0632735U1994-04-28
US4342233A1982-08-03
DE19925458A12000-12-14
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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