Title:
MATERIAL DISTRIBUTION METHOD FOR SEMICONDUCTOR TEST SORTING MACHINE, CONTROL APPARATUS, AND COMPUTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/130802
Kind Code:
A1
Abstract:
A material distribution method for a semiconductor test sorting machine, a control apparatus, and a computer device. The material distribution method comprises: acquiring a batch test result and material distribution tray information of chips in batches (S100); determining grade partition information according to the batch test result and the material distribution tray information (S200); acquiring a test result of a chip to be distributed among the chips in batches (S300); and according to the test result of said chip, the grade partition information and use information of a material distribution tray, moving said chip to a corresponding position in the material distribution tray (S400).
Inventors:
WEI CHONG (CN)
Application Number:
PCT/CN2022/126360
Publication Date:
July 13, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
SUZHOU HYC TECH CO LTD (CN)
International Classes:
B07C5/38; B07C5/344; H01L21/673
Foreign References:
| CN114392937A | 2022-04-26 | |||
| CN106449495A | 2017-02-22 | |||
| CN104276398A | 2015-01-14 | |||
| CN108043746A | 2018-05-18 | |||
| CN113470119A | 2021-10-01 | |||
| JP2005022719A | 2005-01-27 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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