Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MASKING JIG, MOUNTING MEMBER, FILM FORMATION METHOD, AND FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024240
Kind Code:
A1
Abstract:
This masking jig (1) is used in a thermal spraying method. The masking jig (1) is provided with a body part (11). The body part (11) includes a first surface (11a) and a second surface (11b). The second surface (11b) is positioned on the reverse side from the first surface (11a). A body through hole (12) is formed in the body part (11) reaching from the first surface (11a) to the second surface (11b). The masking jig (1) is further provided with a mounting member (14) that can be mounted in/detached from the body through hole (12). A member through hole (15) penetrating in a first direction linking the first surface (11a) and the second surface (11b) when the mounting member (14) is inserted into the body through hole (12) is formed in the mounting member (14). The mounting member (14) is formed from an imide-based resin.

Inventors:
HIRANO MASAKI (JP)
TANAKA SYUNSUKE (JP)
Application Number:
PCT/JP2023/019265
Publication Date:
February 01, 2024
Filing Date:
May 24, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C23C24/04; B05B12/24
Foreign References:
JP2000231880A2000-08-22
JP2015168863A2015-09-28
JP2021119266A2021-08-12
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: