Title:
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/102780
Kind Code:
A1
Abstract:
Provided are a maleimide resin composition, a prepreg obtained using the maleimide resin composition, a resin film, a laminated board, a printed wiring board, and a semiconductor package, the maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than component (B), and component (B) being obtained by modifying a conjugated diene polymer (b1) having a vinyl group in a side chain thereof with a maleimide compound (b2) having two or more N-substituted maleimide groups.
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Inventors:
HAYASHI CHIHIRO (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
AKEBI RYUJI (JP)
SATO NAOYOSHI (JP)
HORIE AKIRA (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
AKEBI RYUJI (JP)
SATO NAOYOSHI (JP)
HORIE AKIRA (JP)
Application Number:
PCT/JP2021/041979
Publication Date:
May 19, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B5/28; B32B15/08; B32B27/30; C08F290/12; C08J5/24; C08L39/04; C08L51/04; C08L53/02; H05K1/03
Foreign References:
| JP2008133454A | 2008-06-12 | |||
| JP2008291227A | 2008-12-04 | |||
| JPS55127419A | 1980-10-02 | |||
| JPH06192478A | 1994-07-12 | |||
| US4229550A | 1980-10-21 |
Other References:
See also references of EP 4245517A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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