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Title:
MALEIMIDE COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AMINE COMPOUND AND REACTION PRODUCT OF AMINE COMPOUND WITH MALEIC ANHYDRIDE
Document Type and Number:
WIPO Patent Application WO/2023/189411
Kind Code:
A1
Abstract:
Provided are a maleimide compound, a curable resin composition and a cured product thereof that have high heat resistance, excellent low dielectric properties and good curability, and an amine compound and a reaction product of an amine compound with maleic anhydride to be used as starting materials thereof. The maleimide compound is represented by formula (1). [In formula (1), multiple Rs independently represent a hydrocarbon group having 1-10 carbon atoms or a haloalkyl group. X is represented by formula (2). m is an integer of 0-4, and n represents the number of repetitions and the average nave of n satisfies 1 ≦ nave ≦ 20.] [In formula (2), multiple Rs independently represent a hydrocarbon group having 1-10 carbon atoms or a haloalkyl group. p is an integer of 0-4, and q is an integer of 0-3. r represents the number of repetitions, and the average rave of r satisfies 1 ≤ rave ≤ 20. * represents the binding site to the aromatic ring of formula (1).]

Inventors:
TOHJIMA TAKAYUKI (JP)
HASHIMOTO MASANORI (JP)
Application Number:
PCT/JP2023/009278
Publication Date:
October 05, 2023
Filing Date:
March 10, 2023
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F8/00; C07D207/452; C08F12/32; C08F290/00
Domestic Patent References:
WO2022054867A12022-03-17
WO2020217677A12020-10-29
WO2022234829A12022-11-10
Foreign References:
JPH05155824A1993-06-22
JPH0539346A1993-02-19
Attorney, Agent or Firm:
SHIN-EI, P.C. (JP)
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