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Patent Searching and Data


Title:
MAGNETRON, MAGNETRON SPUTTERING CHAMBER AND MAGNETRON SPUTTERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/077216
Kind Code:
A1
Abstract:
A magnetron, a magnetron sputtering chamber and a magnetron sputtering device. The magnetron comprises a first outer magnetic pole (101) and a first inner magnetic pole (102) which have opposite polarities, the first outer magnetic pole (101) being an annular structure surrounding a rotation centre (O), the first inner magnetic pole (102) being located on the inner side of the first outer magnetic pole (101), a first magnetic field track (103) being formed between the first inner magnetic pole (102) and the first outer magnetic pole (101). A straight line (L) extending out from the rotation centre (O) along a radial direction passes through the first magnetic field track (103) at least two times, the first magnetic field track (103) having opposite magnetic field directions when the straight line passes through the two times. The magnetron solves the technical problem in the prior art that thin films formed by sputtering having poor uniformity.

Inventors:
YANG YUJIE (CN)
ZHANG TONGWEN (CN)
Application Number:
PCT/CN2017/107831
Publication Date:
May 03, 2018
Filing Date:
October 26, 2017
Export Citation:
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Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
C23C14/35; H01J25/50; H01J37/34
Foreign References:
CN1997768A2007-07-11
CN104937134A2015-09-23
US20030201174A12003-10-30
CN102789941A2012-11-21
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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