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Title:
LOW-VISCOSITY THERMOSETTING PARTICLE BOARD STARCH ADHESIVE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/116055
Kind Code:
A1
Abstract:
The present invention discloses a low-viscosity thermosetting particle board starch adhesive and a preparation method therefor, and belongs to the technical field of adhesive preparation. According to the present invention, a crosslinking monomer, namely N-hydroxyethyl acrylamide or acetoxyethyl methacrylate, which has a low crosslinking degree in an adhesive preparation process but can be quickly crosslinked in a board hot pressing process, is used, such that the problem of the viscosity being increased in an adhesive reaction process is avoided; moreover, the crosslinking monomer undergoes a self-crosslinking reaction in the hot pressing process to form a three-dimensional network structure, so that the water resistance of the adhesive is improved; in addition, an added itaconic acid can promote the occurrence of the self-crosslinking reaction of the crosslinking monomer in the hot pressing process, so that the water resistance of the adhesive is further improved. Various properties of the manufactured particle board reach the standard of P2 type particle boards; meanwhile, various properties of the manufactured plywood exceed the standard of II type plywoods, so that the adhesive can be suitable for mass production and can be widely used in bonding of hot-pressed wood decorations, particle boards, plywoods and fiberboards.

Inventors:
CHENG LI (CN)
JIN JUNNAN (CN)
GU ZHENGBIAO (CN)
LI ZHAOFENG (CN)
HONG YAN (CN)
LI CAIMING (CN)
BAN XIAOFENG (CN)
Application Number:
PCT/CN2022/117435
Publication Date:
June 29, 2023
Filing Date:
September 07, 2022
Export Citation:
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Assignee:
UNIV JIANGNAN (CN)
International Classes:
C09J151/02; C08F220/58; C08F222/02; C08F251/00
Foreign References:
CN114106749A2022-03-01
CN111205794A2020-05-29
CN111647112A2020-09-11
CN107922803A2018-04-17
JP2011057722A2011-03-24
Other References:
SHI JUNYOU, WEN MINGYU, LI XIANGYU, XU WENBIAO, LI ZHIPENG: "Research progress of biomass-based formaldehyde-free adhesives", JOURNAL OF FORESTRY ENGINEERING., vol. 3, no. 2, 1 March 2018 (2018-03-01), pages 1 - 10, XP093073673, DOI: 10.13360/j.issn.2096-1359.2018.02.001
Attorney, Agent or Firm:
HARBIN SHINEIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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