Title:
LIQUID GUIDE ASSEMBLY, HEATING ASSEMBLY, ATOMIZER AND ELECTRONIC ATOMIZATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/077855
Kind Code:
A1
Abstract:
A liquid guide assembly (20), a heating assembly, an atomizer (100) and an electronic atomization apparatus. The liquid guide assembly (20) is used for an electronic atomization apparatus; the liquid guide assembly (20) comprises a heat conduction layer (21) and an isolation layer (22) which are arranged in a stacked manner; the isolation layer (22) is in contact with heating members (30) of the electronic atomization apparatus; the isolation layer (22) is used for isolating the heat conduction layer (21) from the heating members (30); and the isolation layer (22) can transfer to the heat conduction layer (21) part of heat generated by the heating members (30). The liquid guide assembly (20) has better liquid guide effects.
Inventors:
WANG YAQIAO (CN)
CAO RUN (CN)
CHEN SHOUHAO (CN)
DAI HUI (CN)
CAO RUN (CN)
CHEN SHOUHAO (CN)
DAI HUI (CN)
Application Number:
PCT/CN2023/080463
Publication Date:
April 18, 2024
Filing Date:
March 09, 2023
Export Citation:
Assignee:
SHENZHEN SMOORE TECHNOLOGY LTD (CN)
International Classes:
A24F40/46; A24F40/485
Foreign References:
| CN215873462U | 2022-02-22 | |||
| CN215347012U | 2021-12-31 | |||
| CN204483023U | 2015-07-22 | |||
| CN206949544U | 2018-02-02 | |||
| CN213587436U | 2021-07-02 | |||
| US20140196718A1 | 2014-07-17 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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