Title:
LIGHT-MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENT, AND ADHESIVE AGENT FOR DISPLAY ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/176795
Kind Code:
A1
Abstract:
This light-moisture curable resin composition contains a radical polymerizable compound, a moisture-curable resin, and a photo-radical polymerization initiator. The photo-radical polymerization initiator has two or more reaction starting points per molecule.
Inventors:
JO KON (JP)
HAGIWARA KOUHEI (JP)
KIDA TAKUMI (JP)
HAGIWARA KOUHEI (JP)
KIDA TAKUMI (JP)
Application Number:
PCT/JP2023/009702
Publication Date:
September 21, 2023
Filing Date:
March 13, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08F283/00; C09J4/00; C09J201/00
Domestic Patent References:
| WO2021117880A1 | 2021-06-17 | |||
| WO2020149377A1 | 2020-07-23 | |||
| WO2015182697A1 | 2015-12-03 |
Foreign References:
| JP2016089174A | 2016-05-23 | |||
| JPH1180285A | 1999-03-26 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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