LGA SOCKET

WIPO Patent Application WO/2022/070860

A1

Provided is an LGA socket capable of preventing the occurrence of crosstalk during fast transmission and preventing damage to a contact due to warping of a semiconductor package. An LGA socket 100 is provided with: a first insulator 1; a second insulator 2; a center substrate 3 sandwiched from the top and bottom by the first insulator 1 and the second insulator 2, said center substrate 3 having a layered structure of a plurality of layers including a ground layer and having a plurality of through-holes 30-i-j formed so as to pass therethrough between a first opening 10 side and a second opening 20 side; a plurality of pairs of contacts 71-i-j and 72-i-j that are electrically connected to one another as a result of being inserted into the through-holes 30-i-j from the first opening 10 side and the second opening 20 side and soldered; and a first resin member 81-i disposed at the first opening 10 side in the center substrate 3. The first resin member 81-i has: a first basal section 810 for supporting the contacts 71-i-j; and a first stopper 811 that extends upward from the first basal section 810 and that abuts against a package 105 fitted to the first opening 10.

JPS54152165	METHOD OF AND SPRING CONTACT BLOCK SUITABLE FOR MAKING CONDUCTIVE CONNECTION OF BACK WIRING OF PRINTED CONDUCTOR BOARD AND SPRING CONTACT BLOCK
JP7041230	Electrical connector

KIKUCHI KOJI (JP)
HASHIMOTO KAZUYA (JP)
YAMADA YOSHIYA (JP)

PCT/JP2021/033532

April 07, 2022

September 13, 2021

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YAMAICHI ELECTRONICS CO LTD (JP)

H01R12/58; H01R13/24; H01R33/76

CN211208719U	2020-08-07
US20130237091A1	2013-09-12
US20180331442A1	2018-11-15
US10122111B1	2018-11-06

TRY INTERNATIONAL IP LAW FIRM (JP)

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