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Patent Searching and Data


Title:
LEAD CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/038696
Kind Code:
A1
Abstract:
A lead cutting device comprising: a cutting blade for cutting a lead of a lead component; a sensor for detecting the amount of displacement of the cutting blade when a lead is being cut; and a storage device for storing, multiple times, a detection value detected by the sensor.

Inventors:
ANDO YUTAKA (JP)
DEGURA KAZUYA (JP)
Application Number:
PCT/JP2020/031211
Publication Date:
February 24, 2022
Filing Date:
August 19, 2020
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
B23D15/00
Foreign References:
JPH0715184A1995-01-17
JP2008524006A2008-07-10
JPH05327284A1993-12-10
JP2017084922A2017-05-18
JP2015104758A2015-06-08
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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