Title:
LAYERED BODY, ADHESIVE AGENT COMPOSITION, AND CIRCUIT BOARD MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/106206
Kind Code:
A1
Abstract:
This layered body has an adhesive layer on at least one surface of a base material or a conductor layer thereof. The adhesive layer is a cured product of an adhesive agent composition containing a polyester-based resin (A), a polyepoxy-based compound (B), and a filler (C). The dielectric loss tangent (Df) (in an environment where the temperature is 23ºC and a relative humidity is 50%RH) at 10 GHz of the adhesive layer is 0.005 or less.
Inventors:
MUKOZAKA NATSUMI (JP)
NAKANE TAKAYUKI (JP)
NAKANE TAKAYUKI (JP)
Application Number:
PCT/JP2022/044397
Publication Date:
June 15, 2023
Filing Date:
December 01, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C09J167/00; B32B27/00; C09J11/06; C09J11/08; H05K1/03
Domestic Patent References:
| WO2018179707A1 | 2018-10-04 |
Foreign References:
| JP2021134344A | 2021-09-13 | |||
| JP2021066865A | 2021-04-30 | |||
| JP2021088649A | 2021-06-10 | |||
| JP2017031301A | 2017-02-09 | |||
| JP2014193965A | 2014-10-09 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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