Title:
LATENT HEAT STORAGE GYPSUM BOARD AND PARTITION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/259785
Kind Code:
A1
Abstract:
This latent heat storage gypsum board has: a gypsum board having a first main surface and a second main surface positioned on the opposite side to the first major surface; and a latent heat storage layer disposed on at least a portion of the first main surface of the gypsum board and containing a latent heat storage material and a binder, wherein the heat storage amount measured in a measurement temperature range of 15°C to 35°C according to the heat storage amount measurement specified in ASTM C 1784 is 260 kJ/m2 or more, and when heat generation is evaluated according to the heat generation test specified in JIS A 6901 (2014) by setting the surface on which the latent heat storage layer is disposed as the rear surface, the latent heat storage gypsum board is found to have first-class heat generation performance.
Inventors:
NIIMI KATSUMI (JP)
SATO YOSUKE (JP)
NAITO DAISUKE (JP)
SATO YOSUKE (JP)
NAITO DAISUKE (JP)
Application Number:
PCT/JP2022/019429
Publication Date:
December 15, 2022
Filing Date:
April 28, 2022
Export Citation:
Assignee:
YOSHINO GYPSUM CO (JP)
International Classes:
B32B13/04; C04B41/85; C09K5/06; E04B1/76; E04C2/04; E04C2/30; F28D20/02
Foreign References:
| JP2019112929A | 2019-07-11 | |||
| JP2018155076A | 2018-10-04 | |||
| JPH06171008A | 1994-06-21 | |||
| US20130251986A1 | 2013-09-26 | |||
| JP2013506774W | ||||
| JP2021095442A | 2021-06-24 |
Other References:
BISWAS KAUSHIK, SHUKLA YASH, DESJARLAIS ANDRE, RAWAL RAJAN: "Thermal characterization of full-scale PCM products and numerical simulations, including hysteresis, to evaluate energy impacts in an envelope application", APPLIED THERMAL ENGINEERING, PERGAMON, OXFORD, GB, vol. 138, 1 June 2018 (2018-06-01), GB , pages 501 - 512, XP093013065, ISSN: 1359-4311, DOI: 10.1016/j.applthermaleng.2018.04.090
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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