LASER PROCESSING MONITORING METHOD AND DEVICE - TECH UNIV OF KOREA INDUSTRY ACADEMIC COOPERATION FOUNDATION

Title:

LASER PROCESSING MONITORING METHOD AND DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/053800

Kind Code:

A1

Abstract:

The present invention relates to a laser processing monitoring method and device, the method comprising the steps of: radiating a laser to a target according to a signal to start processing of the target; receiving reflected light that is the laser reflected from the target; identifying a reflection amount pattern of the reflected light; and detecting whether a hole generated by the laser radiation is defective on the basis of the reflection amount pattern. In addition, the present invention may have other embodiments.

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Inventors:

LEE YONG KWAN (KR)
KIM SU KYUNG (KR)

Application Number:

PCT/KR2022/021512

Publication Date:

March 14, 2024

Filing Date:

December 28, 2022

Export Citation:

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Assignee:

TECH UNIV OF KOREA INDUSTRY ACADEMIC COOPERATION FOUNDATION (KR)
RESHENIE CORP (KR)

International Classes:

B23K26/03; B23K26/382; B23K31/12

Domestic Patent References:

WO2021186567A1

2021-09-23

Foreign References:

KR20190135068A	2019-12-06
KR20160075238A	2016-06-29
JP2022124799A	2022-08-26
JP2004009074A	2004-01-15

Other References:

이용관 등. 인공지능을 이용한 레이저 홀 가공 자동 불량 검출. 한국정밀공학회 2022년도 춘계학술대회논문집. May 2022, pp. 42-43 (LEE, Yongkwan et al. Automatic Failure Detection for the Laser Micro-hole Machining Using Artificial Intelligence. Proceedings of KSPE 2022 Spring Conference.)