Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/075357
Kind Code:
A1
Abstract:
This laser processing device comprises a first moving part, a second moving part that is movably supported by the first moving part, and a laser emission part that is movably supported by the second moving part. A first maximum movement distance of movement of the second moving part by the first moving part is greater than a second maximum movement distance of movement of the laser emission part by the second moving part. The first moving part can move the second moving part in both a first direction and a second direction orthogonal to the first direction. The second moving part can move the laser emission part in both the first direction and the second direction. While laser light is emitted from the laser emission part to process a workpiece, movement of the second moving part by the first moving part is stopped, but the laser emission part is moved by the second moving part.
Inventors:
NARITA RYUICHI (JP)
GOYA SANEYUKI (JP)
YONEDA JIRO (JP)
SHIOTANI SHIGETOSHI (JP)
ASANO SHIN (JP)
GOYA SANEYUKI (JP)
YONEDA JIRO (JP)
SHIOTANI SHIGETOSHI (JP)
ASANO SHIN (JP)
Application Number:
PCT/JP2023/025379
Publication Date:
April 11, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B23K26/08; B23K26/142; B23K26/16
Domestic Patent References:
| WO2020208808A1 | 2020-10-15 |
Foreign References:
| JP2001212689A | 2001-08-07 | |||
| JP2006068773A | 2006-03-16 | |||
| JP2008132616A | 2008-06-12 |
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
Download PDF: