Title:
LAMINATED SEALANT FILM
Document Type and Number:
WIPO Patent Application WO/2024/084928
Kind Code:
A1
Abstract:
Provided is a laminated sealant film that is comprehensively and satisfactorily exceptional in terms of bag formation properties at low temperatures and all of rupture strength, heat resistance, stand-alone properties, and transparency after bag formation, the laminated sealant film satisfying all of the following conditions 1) to 9). 1) The laminated sealant film includes at least a laminate layer and a sealing layer. 2) The laminate layer comprises a resin composition having, as the main component, a polypropylene resin. 3) The sealing layer comprises a resin composition having, as the main component, a mixture of a polypropylene resin and a polyethylene resin. 4) With respect to 100 wt% of the mixture of the polypropylene resin and the polyethylene resin constituting the sealing layer, the polypropylene resin is contained in an amount of 1-95 wt% inclusive, and the polyethylene resin is contained in an amount of 5-99 wt% inclusive. 5) The polyethylene resin constituting the sealing layer contains 90 wt% or more of a straight-chain low-density polyethylene resin. 6) There is a difference of 15°C or more between the respective melting points of the straight-chain low-density polyethylene resin and the polypropylene resin of the sealing layer. 7) The ratio of the melt flow rate of the polypropylene resin to the melt flow rate of the straight-chain low-density polyethylene resin of the sealing layer is 0.8-2.0 inclusive. 8) The melt flow rates of the straight-chain low-density polyethylene resin and the polypropylene resin of the sealing layer are 9 g/10 minutes or lower. 9) The longitudinal-direction tensile elastic modulus is 500 MPa or lower.
Inventors:
FUJINO HIDETOSHI (JP)
Application Number:
PCT/JP2023/035779
Publication Date:
April 25, 2024
Filing Date:
September 29, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/32; B65D65/40
Domestic Patent References:
| WO2022107576A1 | 2022-05-27 | |||
| WO2021205812A1 | 2021-10-14 | |||
| WO2023085049A1 | 2023-05-19 |
Foreign References:
| JP2005103902A | 2005-04-21 | |||
| JP2015199228A | 2015-11-12 | |||
| JP2005178337A | 2005-07-07 | |||
| JP2001026083A | 2001-01-30 |
Download PDF: