Title:
LAMINATE AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/282068
Kind Code:
A1
Abstract:
Provided are: a laminate for packaging which can be reduced in the amount of plastic used therein, especially one suitable for use as bags and excellent in terms of processability, especially foldability, etc.; and a packaging material obtained from the laminate. The laminate comprises a paper base having a basis weight of 10 g/m2 to 100 g/m2 and a heat-sealing layer disposed in contact with the paper base, wherein the heat-sealing layer comprises a polyester (A) having a glass transition temperature of 30-60°C. The packaging material is obtained by forming the laminate into a bag.
Inventors:
NAKAMURA MAKOTO (JP)
OHARA SHIN-ICHI (JP)
OHARA SHIN-ICHI (JP)
Application Number:
PCT/JP2022/025006
Publication Date:
January 12, 2023
Filing Date:
June 23, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/10; B32B27/36; B32B29/00; B65D65/42; C09J167/00; D21H27/30
Domestic Patent References:
| WO2014156344A1 | 2014-10-02 |
Foreign References:
| JPH05305699A | 1993-11-19 | |||
| JPH0853606A | 1996-02-27 | |||
| JP2002087459A | 2002-03-27 | |||
| JPS5563745U | 1980-05-01 | |||
| JP2022018369A | 2022-01-27 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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