Title:
LAMINATE MANUFACTURING METHOD, AND LAMINATE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/080207
Kind Code:
A1
Abstract:
This laminate manufacturing method comprises: a bonding step in which a laminated film having a base material film and an inorganic layer laminated on the base material film is bonded to a substrate; and a cutting step in which the laminated film is cut to match the shape of the substrate. During the cutting step, a cutting tool is heated to a temperature not lower than 65ºC below the softening point temperature of the base material film, and the laminated film is cut.
Inventors:
HINO TOMOKAZU (JP)
Application Number:
PCT/JP2023/036241
Publication Date:
April 18, 2024
Filing Date:
October 04, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B26D7/10
Foreign References:
| JP2004174664A | 2004-06-24 | |||
| JP2000143265A | 2000-05-23 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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