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Patent Searching and Data


Title:
INTEGRATED THERMAL MANAGEMENT MODULE
Document Type and Number:
WIPO Patent Application WO/2024/087378
Kind Code:
A1
Abstract:
An integrated thermal management module, comprising a refrigerant side valve plate (1). A plurality of connecting pipelines are formed on the refrigerant side valve plate (1), and the refrigerant side valve plate (1) is configured as a bearing connecting member of an integrated thermal management system; at least two mounting openings are formed on the refrigerant side valve plate (1), the two mounting openings are communicated by means of the connecting pipeline, and thermal management components are provided in the mounting openings.

Inventors:
ZHANG SHIYE (CN)
ZHANG WEIWEI (CN)
Application Number:
PCT/CN2022/142898
Publication Date:
May 02, 2024
Filing Date:
December 28, 2022
Export Citation:
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Assignee:
ZHEJIANG LEAPPOWER TECH CO LTD (CN)
ZHEJIANG LEAPMOTOR TECH CO LTD (CN)
International Classes:
B60H1/00
Foreign References:
CN215552421U2022-01-18
CN112569698A2021-03-30
CN113276630A2021-08-20
CN113276628A2021-08-20
CN216033602U2022-03-15
KR20200143787A2020-12-28
Attorney, Agent or Firm:
HANGZHOU GOALTZWISH INTELLECTUAL PROPERTY OFFICE (CN)
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